Ultra-clean bags for packaging semiconductor-related parts
Issue
- Control even invisible particulates and outgassing generated from resin
Features
- Ultra-clean film with cleanliness at the highest level achievable with resin
Application/Industry
- Packaging of semiconductor manufacturing parts
Issue background
Challenges for packaging materials for semiconductors, where cleanliness is crucial
Resin is an aggregate of components with high molecular weights, but molecular weight inevitably varies, and components with low molecular weights are generated from the film as particulates and outgassing. The cleanliness class for Japanese semiconductors, called “eleven-nine,” boasts purity up to 99.999999999%, and even contamination with foreign matter at microlevels is strictly prohibited. Packaging materials are also needed in a field like this.
Solution
Development of film with cleanliness at the highest level achievable with resin
By combining very special raw materials, both particulates and outgassing are kept to an absolute minimum. In addition, as a bag, it must be able to be sealed after the contents are inserted, and we have succeeded in achieving this through special technology.
