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HC-GS

Additive-free 3-layer clean film suitable for precision parts, resistant to friction and bending during product transportation

  • Cleanliness
  • High strength
  • Environmentally friendly (RoHS directive / REACH regulations)
HC-GS

HC-GS

Overview

HC-GS is an additive-free 3-layer clean film. Raw materials with low-ion contamination and outgassing used in the film result in a very high level of cleanliness. These make it suitable for packaging semiconductors, electronics parts, liquid crystals, and precision parts. In addition, the intermediate layer is made of robust special polyethylene that minimizes pinholes caused by friction and bending during product transportation.

  • Low ion contamination, low outgassing

  • Product design that extends to high cleanliness

  • Outstanding strength and durability

  • No use of environmentally hazardous chemical substances

Features

  1. Low ionic contamination and low outgassing

    Achieves low-ion contamination and outgassing

    HC-GS is designed and developed based on the concept of low-ion contamination and outgassing.

  2. High clean packaging to LC/HDD/SC

    Product design covering high cleanliness

    By use of additive-free resin and blown film method, the film provides a particularly high level of cleanliness of the inner surface. In addition,liquid particle counter (LPC) is in our process to control the cleanliness level, and our products are used confidently in industries that demand high cleanliness levels, such as LCD, HDD, and semiconductors.

  3. High clean packaging with good pinhole resistance

    Outstanding strength and durability

    Special polyethylene resin is in the intermediate layer to boost its strength, raising the overall strength of film. Its high pinhole resistance reduces pinholes caused by friction and bending during product transportation.

  4. Conformance to International chemical regulations

    No use of environmentally hazardous chemical substances

    Regular analysis is conducted to confirm HC-GS film complies with the RoHS directive and REACH regulations.

Application

  • Electronics components
    • Semiconductor materials
    • Semiconductor parts
    • Wafer cases
    • Backlight units

Specifications

Main applications
Semiconductor materials /
Semiconductor parts /
Wafer cases /
Backlight units
Layer composition
Number of layers
3 layers
Composition
PE / PE / PE
Standard
Thickness
50μm ～ 100μm
Width
180mm ～ 1500mm
Specifications

Table can swipe left or right

Test item Test method Units 50μm 60μm 70μm 80μm 100μm
Tensile strength JIS Z 1702 MPa MD 25 25 27 28 28
TD 39 39 39 39 37
N MD 11.2 15.5 18.7 22.2 27.3
TD 18.8 21.9 27 30.6 36.2
Tensile elongation JIS Z 1702 ％ MD 563 496 548 585 590
TD 724 718 711 733 703
Tear strength JIS K 7128 N/mm MD 102 106 110 106 106
TD 100 97 101 98 94
N MD 5.0 6.6 7.8 8.7 10.6
TD 4.5 5.7 7.0 7.9 9.4
Heat sealing strength JIS Z 1711 N/15mm 9.5 11 12.1 13.8 16.2
Particulate measurement Shikoku Kakoh method pcs/cm2 Inner surface 5 5 5 5 5

*These are representative values and not guaranteed.

Process

  1. STEP.01

    Consultation/Inquiry

  2. STEP.02

    Specifications meeting / Estimate creation

  3. STEP.03

    Order / Production start

  4. STEP.04

    Shipping / Delivery

  5. STEP.05

    After-sales service

FAQ

What are its features?
This additive-free PE film provides excellent cleanliness.
Do you have colored films?
No, it cannot be printed on.
Can it be printed on?
No, it cannot be printed on.
Does it contain environmentally hazardous substances?
No, it does not contain environmentally hazardous substances.

Contact us

Please feel free to contact us for any request or consultation.

Contact us